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arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS) device variants to create a secure u-boot_HS.img FIT blob that contains U-Boot and DTB artifacts signed with a TI-specific process based on the CONFIG_TI_SECURE_DEVICE config option and the externally-provided image signing tool. Also populate the corresponding FIT image post processing call to be performed during SPL runtime. Signed-off-by:Daniel Allred <d-allred@ti.com> Signed-off-by:
Andreas Dannenberg <dannenberg@ti.com> Reviewed-by:
Tom Rini <trini@konsulko.com>
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- arch/arm/cpu/armv7/omap5/config.mk 3 additions, 0 deletionsarch/arm/cpu/armv7/omap5/config.mk
- board/ti/am57xx/board.c 8 additions, 0 deletionsboard/ti/am57xx/board.c
- board/ti/dra7xx/evm.c 9 additions, 0 deletionsboard/ti/dra7xx/evm.c
- configs/am57xx_hs_evm_defconfig 1 addition, 0 deletionsconfigs/am57xx_hs_evm_defconfig
- configs/dra7xx_hs_evm_defconfig 1 addition, 0 deletionsconfigs/dra7xx_hs_evm_defconfig
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